Semiconductor Wafer Used Electrostatic Chucks ESC

Semiconductor Wafer Used Electrostatic Chucks ESC Market Outlook

The global semiconductor wafer used electrostatic chucks (ESC) market is estimated to reach USD 2.1 billion by 2035, growing at a robust compound annual growth rate (CAGR) of 7.2% during the forecast period from 2025 to 2035. Several growth factors are propelling this market, including the increasing demand for miniaturization and precision in semiconductor devices, the rise in the adoption of advanced manufacturing technologies, and the expanding application scope in sectors like optoelectronics and MEMS. Moreover, the ongoing advancements in semiconductor materials and processes are also encouraging manufacturers to invest in high-quality ESC solutions to enhance production efficiency. This is further supported by the rapid developments in electronic devices, which require highly sophisticated and efficient manufacturing equipment.

Growth Factor of the Market

One of the primary growth factors driving the semiconductor wafer used electrostatic chucks market is the increasing demand for semiconductor devices across diverse industries, including automotive, consumer electronics, and telecommunications. The trend towards automation and smart technologies in manufacturing processes necessitates the use of high-performance equipment like electrostatic chucks, which are essential for the precise handling of wafers during fabrication processes. Additionally, the escalating need for energy-efficient solutions in semiconductor manufacturing is promoting the adoption of ESC, as they reduce the energy consumption associated with wafer handling. Another significant factor is the continuous innovation in materials used for ESC, which enhances their durability and efficiency, further supporting market growth. As industries increasingly focus on reducing production costs while improving yield rates, electric chucks are becoming integral to achieving these manufacturing goals.

Key Highlights of the Market

• The global semiconductor wafer used electrostatic chucks market is projected to grow at a CAGR of 7.2% from 2025 to 2035.
• Advancements in semiconductor manufacturing technologies are driving the demand for high-quality ESC solutions.
• Asia Pacific is anticipated to hold the largest market share due to the presence of major semiconductor manufacturing hubs.
• Ceramic ESC is expected to dominate the product type segment owing to its superior performance and thermal stability.
• The increasing adoption of smart and automated systems in manufacturing processes is enhancing the market prospects for ESC.

By Product Type

Ceramic ESC:

Ceramic electrostatic chucks are widely regarded for their excellent thermal stability and electrical insulation properties, making them a preferred choice in semiconductor wafer handling applications. They provide superior performance in demanding environments, ensuring consistent clamping forces and precision. Their resistance to high temperatures enhances their durability, which is crucial for maintaining efficiency in semiconductor manufacturing processes. The ability to withstand harsh chemicals used in etching and cleaning also adds to their appeal, as it minimizes wear and prolongs the product's lifecycle. This segment is expected to maintain a significant presence in the market due to the ongoing trends towards advanced materials and high-performance equipment.

Metal ESC:

Metal electrostatic chucks are known for their robust construction and are often employed in environments where high mechanical strength is required. These ESCs typically offer excellent electrical conductivity and thermal management properties, which is crucial for various semiconductor processing applications. The ability of metal ESCs to handle larger and heavier wafers without compromising performance is a key factor driving their adoption in semiconductor manufacturing. Furthermore, the ongoing advancements in metal alloys and coatings are enhancing their performance characteristics, thereby expanding their application scope. As the demand for higher handling capacity and thermal efficiency in manufacturing processes grows, metal ESCs are likely to gain traction in the market.

Quartz ESC:

Quartz electrostatic chucks are emerging as an innovative solution in wafer handling due to their unique properties, including high thermal conductivity and excellent dimensional stability. These characteristics make quartz ESC ideal for sensitive processes where maintaining precise wafer positioning is critical. Their ability to operate at high temperatures without deformation enhances their application in advanced semiconductor fabrication processes. As industries seek to minimize contamination and enhance yield in high-precision manufacturing, quartz ESCs are finding increased usage, particularly in high-tech applications like optoelectronics and MEMS. Consequently, the demand for quartz ESC is anticipated to increase significantly, driven by these advantageous properties.

Silicon ESC:

Silicon electrostatic chucks are increasingly gaining popularity due to their compatibility with silicon wafers, which are prevalent in semiconductor manufacturing. Their design allows for effective electrostatic clamping while ensuring minimal thermal expansion, which is crucial for maintaining wafer integrity during processing. These ESCs are particularly useful in processes such as plasma etching and chemical vapor deposition, where precise temperature control and minimal contamination are essential. The growth of the silicon ESC market is supported by the ongoing advancements in silicon processing technologies and the expanding use of silicon-based devices in various applications, driving demand for tailored clamping solutions.

Glass ESC:

Glass electrostatic chucks are relatively newer in the market and are recognized for their lightweight and high thermal shock resistance properties. They are particularly suitable for applications that require handling of fragile substrates, such as those used in display technologies and certain semiconductor processes. The ability of glass ESCs to provide precise alignment and uniform clamping pressure makes them attractive for delicate manufacturing environments. As industries increasingly focus on producing thinner and more sensitive devices, the demand for glass ESCs is expected to rise, positioning them as a noteworthy segment within the broader ESC market.

By Application

Semiconductor Manufacturing:

The semiconductor manufacturing segment is the largest consumer of electrostatic chucks, owing to the high precision and efficiency required in wafer fabrication processes. Electrostatic chucks play a pivotal role in ensuring that wafers are securely held during various processes, including photolithography, etching, and chemical vapor deposition. The continuous evolution of semiconductor technology, such as the transition to smaller process nodes and the integration of new materials, is driving the demand for advanced ESC solutions. As manufacturers strive to improve yield rates and reduce defects, the role of ESCs becomes increasingly critical, thus supporting significant market growth in this segment.

Electronics:

In the electronics segment, electrostatic chucks are widely utilized in the manufacturing of various electronic components, including printed circuit boards (PCBs) and integrated circuits (ICs). The demand for smaller, more efficient electronic devices is pushing manufacturers to adopt high-performance handling solutions like ESCs to ensure accuracy and precision during production. As consumer electronics continue to evolve towards more compact and feature-rich designs, the need for innovative manufacturing processes increases, driving the adoption of electrostatic chucks across the electronics sector. This trend positions the electronics application segment as a key contributor to the overall growth of the market.

Optoelectronics:

Electrostatic chucks are gaining traction in the optoelectronics application as they are essential for the production of components such as LEDs, lasers, and photonic devices. The growing demand for advanced lighting solutions and high-performance optical devices is fueling the need for precise handling technologies during manufacturing. ESCs provide the necessary stability and control required for the delicate processes involved in optoelectronic fabrication. As industries increasingly prioritize energy-efficient and high-performance optical solutions, the optoelectronics segment is expected to witness substantial growth, further boosting the demand for electrostatic chucks.

MEMS:

The Micro-Electro-Mechanical Systems (MEMS) segment is another significant application area for electrostatic chucks, driven by the growing demand for miniaturized devices with enhanced functionalities. MEMS devices are used in a wide range of applications, including sensors, actuators, and microfluidics, all of which require precision handling during manufacturing. Electrostatic chucks offer the necessary stability and force control to ensure efficient wafer processing for MEMS devices, which often involve complex fabrication steps. The increasing integration of MEMS technology in consumer electronics, automotive, and medical devices is expected to contribute to the rising demand for ESCs in this application segment.

Others:

The 'Others' segment encompasses various niche applications of electrostatic chucks beyond the mainstream sectors of semiconductor manufacturing, electronics, optoelectronics, and MEMS. This includes applications in fields such as renewable energy and specialized industrial processes. As industries explore innovative technologies and processes, the requirement for effective wafer handling solutions is expected to expand, creating opportunities for electrostatic chucks. The versatility of ESCs makes them suitable for a wide range of uses, and as technological advancements continue to emerge, this segment is poised for growth in the coming years.

By Distribution Channel

Direct Sales:

Direct sales channels play a critical role in the distribution of electrostatic chucks, allowing manufacturers to establish direct relationships with their clients. This approach enhances customer engagement and offers personalized support during the purchasing process. Direct sales often enable customers to receive tailored solutions that meet their specific manufacturing needs, fostering customer loyalty. Furthermore, direct interactions allow manufacturers to gather feedback on products and services, driving continuous improvement and innovation. As the demand for highly customized solutions in semiconductor manufacturing grows, direct sales channels are expected to remain a significant part of the ESC market.

Distributors:

Distributors serve as a vital link between manufacturers and end-users in the electrostatic chuck market. They provide widespread access to various ESC products and solutions, enabling manufacturers to reach a broader customer base more efficiently. Distributors often maintain extensive inventories of different ESC types, allowing customers to quickly source the products they need without lengthy lead times. Additionally, they offer technical support and expertise to help customers select the right solutions for their applications. The reliance on distributors is expected to grow as more manufacturers seek to expand their market reach while minimizing logistical challenges.

Online Retail:

Online retail channels are increasingly gaining traction in the electrostatic chuck market, driven by the growing trend of e-commerce. The convenience of online platforms allows customers to explore a wide range of ESC products and compare options quickly. Online retail also provides access to detailed product specifications, reviews, and customer feedback, aiding in informed purchasing decisions. As industries continue to digitize their procurement processes, online retail channels are expected to become an essential aspect of the ESC market. The ability to place orders from anywhere at any time aligns with the increasing demand for efficiency and flexibility in manufacturing operations.

By Material Type

Alumina:

Alumina is a widely used material in the manufacturing of electrostatic chucks due to its excellent thermal and electrical insulation properties. Its robustness and resistance to chemical corrosion make alumina-based ESCs suitable for various semiconductor manufacturing applications where high temperatures and reactive environments are involved. The demand for alumina ESCs is driven by the growing focus on durability and performance in wafer handling solutions. As semiconductor processes become more complex and require high precision, the use of alumina in ESCs is expected to continue to thrive, further solidifying its position in the market.

Silicon Carbide:

Silicon carbide is gaining popularity in the electrostatic chuck market due to its exceptional thermal stability and hardness. This material's ability to withstand extreme temperatures and harsh processing conditions makes it ideal for high-performance applications in semiconductor manufacturing. Silicon carbide ESCs offer improved efficiency and longevity, which are crucial for maintaining productivity in fast-paced manufacturing environments. As the semiconductor industry continues to evolve towards more demanding applications, the adoption of silicon carbide as a material for ESCs is anticipated to grow significantly, driven by the need for enhanced performance.

Titanium:

Titanium is increasingly being used in the production of electrostatic chucks, particularly in applications requiring high strength-to-weight ratios. The lightweight nature of titanium combined with its mechanical strength makes it an attractive choice for ESCs used in various semiconductor processes. Additionally, titanium exhibits excellent resistance to corrosion and oxidation, contributing to longer lifespan and reliability in challenging manufacturing environments. The demand for titanium-based electrostatic chucks is expected to rise as industries seek to optimize performance and efficiency in their manufacturing processes.

Stainless Steel:

Stainless steel is a versatile material commonly used in the production of electrostatic chucks due to its corrosion resistance and structural integrity. The durability of stainless steel ESCs makes them suitable for a variety of applications in the semiconductor manufacturing sector, where exposure to chemicals and temperature fluctuations can pose challenges. These electrostatic chucks can withstand rigorous manufacturing conditions, ensuring consistent performance over time. As industries focus on improving equipment robustness and reducing maintenance costs, the use of stainless steel in ESC applications is projected to grow, further enhancing the material's market presence.

Others:

The 'Others' material segment includes alternative materials utilized in the manufacture of electrostatic chucks, which may be less common but still relevant. These materials can offer unique properties that cater to specialized applications or specific customer needs. The ongoing research and development in materials science may lead to the discovery of innovative materials that enhance the performance of ESCs. As technologies advance and manufacturers seek to improve efficiency and effectiveness, this segment is likely to see growth driven by demands for cost-effective and high-performance materials.

By Region

The Asia Pacific region is poised to dominate the semiconductor wafer used electrostatic chucks market, accounting for approximately 45% of the global market share in 2025. This dominance is primarily attributed to the presence of leading semiconductor manufacturers and a robust supply chain ecosystem in countries such as China, Japan, and South Korea. The rapid industrialization and growing demand for electronic devices in this region are further propelling the need for advanced manufacturing technologies, including electrostatic chucks. Moreover, with a projected CAGR of 7.5%, Asia Pacific is expected to continue leading the market through 2035.

North America is expected to hold a significant share of the semiconductor wafer used electrostatic chucks market, driven by the ongoing technological advancements and the presence of major players in the semiconductor industry. The region is projected to account for around 25% of the overall market by 2025. The increasing investment in research and development activities, particularly in the field of semiconductors, is fostering growth in this region. Additionally, the emphasis on energy-efficient manufacturing processes is expected to drive the adoption of electrostatic chucks, contributing to a steady CAGR of approximately 6.8% through 2035. Europe also represents a key market, characterized by a focus on innovation and sustainability in semiconductor manufacturing.

Opportunities

The semiconductor wafer used electrostatic chucks market is witnessing significant opportunities driven by the increasing demand for advanced semiconductor technologies. The rise of emerging technologies, such as 5G, the Internet of Things (IoT), and artificial intelligence (AI), is creating a surge in the need for high-performance semiconductor components. These advancements necessitate the adoption of efficient manufacturing solutions, including electrostatic chucks, that can enhance production efficiency and yield rates. As companies strive to meet the challenges of complexity and miniaturization in semiconductor manufacturing, they are likely to invest more in high-quality ESC solutions, presenting a substantial growth opportunity for market players.

Furthermore, the ongoing trend of automation in manufacturing processes opens up new avenues for the electrostatic chucks market. As industries increasingly adopt automated systems and robotics to enhance productivity, the demand for reliable and precise wafer handling solutions is expected to rise substantially. ESCs are integral to achieving optimal performance in automated semiconductor manufacturing plants, thus creating opportunities for product innovation and development. Moreover, as manufacturers seek to integrate sustainability into their operations, the emphasis on energy-efficient solutions provides an additional growth avenue for ESCs, as they contribute to reducing energy consumption during the semiconductor fabrication processes.

Threats

Despite the promising growth prospects, the semiconductor wafer used electrostatic chucks market faces several threats that could impede its expansion. One of the primary concerns is the rapid pace of technological advancements, which can lead to obsolescence of existing products. As manufacturers continuously innovate to meet the evolving demands of semiconductor fabrication, there is a risk that certain ESC technologies may become outdated, necessitating ongoing investment in research and development. Additionally, the potential for economic fluctuations and uncertainties in global trade can impact the semiconductor industry and, by extension, the market for electrostatic chucks, as manufacturers may delay capital expenditures during challenging economic times.

Moreover, increasing competition from alternative wafer handling technologies poses a significant challenge to the market. New entrants and established players are continuously developing innovative solutions that may offer competitive advantages over traditional electrostatic chucks, leading to potential market share erosion. Additionally, the complex regulatory landscape surrounding semiconductor manufacturing processes can also present challenges for manufacturers seeking to introduce new products or technologies. As a result, industry players must remain vigilant and adapt to changing market dynamics to mitigate these threats effectively.

Competitor Outlook

• Applied Materials, Inc.
• Tokyo Electron Limited
• Lam Research Corporation
• ASML Holding N.V.
• KLA Corporation
• Hitachi High-Tech Corporation
• Advantest Corporation
• Semes Co., Ltd.
• VEECO Instruments Inc.
• Chukoh Chemical Industries Ltd.
• Fujitsu Ltd.
• ULVAC, Inc.
• Microtech Ventures, Inc.
• SUSS MicroTec SE
• NTT Advanced Technology Corporation

The competitive landscape of the semiconductor wafer used electrostatic chucks market is characterized by a mix of established players and emerging companies vying for market share. Market leaders such as Applied Materials, Tokyo Electron Limited, and Lam Research Corporation dominate the landscape due to their extensive experience, innovation capabilities, and strong customer relationships. These companies continuously invest in research and development to enhance their product offerings and maintain their competitive edge in the rapidly evolving semiconductor industry. Additionally, they often collaborate with semiconductor manufacturers to tailor ESC solutions to specific applications, reinforcing their market position.

Emerging companies are also making significant strides in the electrostatic chuck market by focusing on niche technologies and innovative materials. Companies like VEECO Instruments Inc. and SUSS MicroTec SE are leveraging their expertise in advanced manufacturing processes to introduce novel ESC designs that cater to the growing demands of semiconductor fabrication. The competitive landscape is also witnessing an influx of startups exploring unique solutions that address specific challenges faced by manufacturers in wafer handling, thus intensifying competition. As a result, established players are compelled to adapt and innovate to retain their market share amidst this growing competitive pressure.

In summary, the semiconductor wafer used electrostatic chucks market is poised for significant growth, driven by increasing demand across various applications and advancing technologies. While established players maintain a strong foothold, the emergence of innovative startups and companies focusing on specialized solutions is reshaping the competitive dynamics within the market. To stay ahead in this competitive landscape, companies must continually invest in research and development, explore strategic partnerships, and adapt to the evolving needs of the semiconductor manufacturing industry. The ability to provide high-performance, efficient, and customized ESC solutions will be crucial for success in this burgeoning market.

• 1 Appendix

  • 1.1 List of Tables
  • 1.2 List of Figures

• 2 Introduction

  • 2.1 Market Definition
  • 2.2 Scope of the Report
  • 2.3 Study Assumptions
  • 2.4 Base Currency & Forecast Periods

• 3 Market Dynamics

  • 3.1 Market Growth Factors
  • 3.2 Economic & Global Events
  • 3.3 Innovation Trends
  • 3.4 Supply Chain Analysis

• 4 Consumer Behavior

  • 4.1 Market Trends
  • 4.2 Pricing Analysis
  • 4.3 Buyer Insights

• 5 Key Player Profiles

  • 5.1 ULVAC, Inc.
    • 5.1.1 Business Overview
    • 5.1.2 Products & Services
    • 5.1.3 Financials
    • 5.1.4 Recent Developments
    • 5.1.5 SWOT Analysis
  • 5.2 Fujitsu Ltd.
    • 5.2.1 Business Overview
    • 5.2.2 Products & Services
    • 5.2.3 Financials
    • 5.2.4 Recent Developments
    • 5.2.5 SWOT Analysis
  • 5.3 KLA Corporation
    • 5.3.1 Business Overview
    • 5.3.2 Products & Services
    • 5.3.3 Financials
    • 5.3.4 Recent Developments
    • 5.3.5 SWOT Analysis
  • 5.4 Semes Co., Ltd.
    • 5.4.1 Business Overview
    • 5.4.2 Products & Services
    • 5.4.3 Financials
    • 5.4.4 Recent Developments
    • 5.4.5 SWOT Analysis
  • 5.5 SUSS MicroTec SE
    • 5.5.1 Business Overview
    • 5.5.2 Products & Services
    • 5.5.3 Financials
    • 5.5.4 Recent Developments
    • 5.5.5 SWOT Analysis
  • 5.6 ASML Holding N.V.
    • 5.6.1 Business Overview
    • 5.6.2 Products & Services
    • 5.6.3 Financials
    • 5.6.4 Recent Developments
    • 5.6.5 SWOT Analysis
  • 5.7 Advantest Corporation
    • 5.7.1 Business Overview
    • 5.7.2 Products & Services
    • 5.7.3 Financials
    • 5.7.4 Recent Developments
    • 5.7.5 SWOT Analysis
  • 5.8 Tokyo Electron Limited
    • 5.8.1 Business Overview
    • 5.8.2 Products & Services
    • 5.8.3 Financials
    • 5.8.4 Recent Developments
    • 5.8.5 SWOT Analysis
  • 5.9 VEECO Instruments Inc.
    • 5.9.1 Business Overview
    • 5.9.2 Products & Services
    • 5.9.3 Financials
    • 5.9.4 Recent Developments
    • 5.9.5 SWOT Analysis
  • 5.10 Applied Materials, Inc.
    • 5.10.1 Business Overview
    • 5.10.2 Products & Services
    • 5.10.3 Financials
    • 5.10.4 Recent Developments
    • 5.10.5 SWOT Analysis
  • 5.11 Lam Research Corporation
    • 5.11.1 Business Overview
    • 5.11.2 Products & Services
    • 5.11.3 Financials
    • 5.11.4 Recent Developments
    • 5.11.5 SWOT Analysis
  • 5.12 Microtech Ventures, Inc.
    • 5.12.1 Business Overview
    • 5.12.2 Products & Services
    • 5.12.3 Financials
    • 5.12.4 Recent Developments
    • 5.12.5 SWOT Analysis
  • 5.13 Hitachi High-Tech Corporation
    • 5.13.1 Business Overview
    • 5.13.2 Products & Services
    • 5.13.3 Financials
    • 5.13.4 Recent Developments
    • 5.13.5 SWOT Analysis
  • 5.14 Chukoh Chemical Industries Ltd.
    • 5.14.1 Business Overview
    • 5.14.2 Products & Services
    • 5.14.3 Financials
    • 5.14.4 Recent Developments
    • 5.14.5 SWOT Analysis
  • 5.15 NTT Advanced Technology Corporation
    • 5.15.1 Business Overview
    • 5.15.2 Products & Services
    • 5.15.3 Financials
    • 5.15.4 Recent Developments
    • 5.15.5 SWOT Analysis

• 6 Market Segmentation

  • 6.1 Semiconductor Wafer Used Electrostatic Chucks ESC Market, By Application
    • 6.1.1 Semiconductor Manufacturing
    • 6.1.2 Electronics
    • 6.1.3 Optoelectronics
    • 6.1.4 MEMS
    • 6.1.5 Others
  • 6.2 Semiconductor Wafer Used Electrostatic Chucks ESC Market, By Product Type
    • 6.2.1 Ceramic ESC
    • 6.2.2 Metal ESC
    • 6.2.3 Quartz ESC
    • 6.2.4 Silicon ESC
    • 6.2.5 Glass ESC
  • 6.3 Semiconductor Wafer Used Electrostatic Chucks ESC Market, By Material Type
    • 6.3.1 Alumina
    • 6.3.2 Silicon Carbide
    • 6.3.3 Titanium
    • 6.3.4 Stainless Steel
    • 6.3.5 Others
  • 6.4 Semiconductor Wafer Used Electrostatic Chucks ESC Market, By Distribution Channel
    • 6.4.1 Direct Sales
    • 6.4.2 Distributors
    • 6.4.3 Online Retail

• 7 Competitive Analysis

  • 7.1 Key Player Comparison
  • 7.2 Market Share Analysis
  • 7.3 Investment Trends
  • 7.4 SWOT Analysis

• 8 Research Methodology

  • 8.1 Analysis Design
  • 8.2 Research Phases
  • 8.3 Study Timeline

• 9 Future Market Outlook

  • 9.1 Growth Forecast
  • 9.2 Market Evolution

• 10 Geographical Overview

  • 10.1 Europe - Market Analysis
    • 10.1.1 By Country
      • 10.1.1.1 UK
      • 10.1.1.2 France
      • 10.1.1.3 Germany
      • 10.1.1.4 Spain
      • 10.1.1.5 Italy
  • 10.2 Asia Pacific - Market Analysis
    • 10.2.1 By Country
      • 10.2.1.1 India
      • 10.2.1.2 China
      • 10.2.1.3 Japan
      • 10.2.1.4 South Korea
  • 10.3 Latin America - Market Analysis
    • 10.3.1 By Country
      • 10.3.1.1 Brazil
      • 10.3.1.2 Argentina
      • 10.3.1.3 Mexico
  • 10.4 North America - Market Analysis
    • 10.4.1 By Country
      • 10.4.1.1 USA
      • 10.4.1.2 Canada
  • 10.5 Middle East & Africa - Market Analysis
    • 10.5.1 By Country
      • 10.5.1.1 Middle East
      • 10.5.1.2 Africa
  • 10.6 Semiconductor Wafer Used Electrostatic Chucks ESC Market by Region

• 11 Global Economic Factors

  • 11.1 Inflation Impact
  • 11.2 Trade Policies

• 12 Technology & Innovation

  • 12.1 Emerging Technologies
  • 12.2 AI & Digital Trends
  • 12.3 Patent Research

• 13 Investment & Market Growth

  • 13.1 Funding Trends
  • 13.2 Future Market Projections

• 14 Market Overview & Key Insights

  • 14.1 Executive Summary
  • 14.2 Key Trends
  • 14.3 Market Challenges
  • 14.4 Regulatory Landscape

Segments Analyzed in the Report

The global Semiconductor Wafer Used Electrostatic Chucks ESC market is categorized based on

By Product Type

• Ceramic ESC
• Metal ESC
• Quartz ESC
• Silicon ESC
• Glass ESC

By Application

• Semiconductor Manufacturing
• Electronics
• Optoelectronics
• MEMS
• Others

By Distribution Channel

• Direct Sales
• Distributors
• Online Retail

By Material Type

• Alumina
• Silicon Carbide
• Titanium
• Stainless Steel
• Others

By Region

• North America
• Europe
• Asia Pacific
• Latin America
• Middle East & Africa

Key Players

• Applied Materials, Inc.
• Tokyo Electron Limited
• Lam Research Corporation
• ASML Holding N.V.
• KLA Corporation
• Hitachi High-Tech Corporation
• Advantest Corporation
• Semes Co., Ltd.
• VEECO Instruments Inc.
• Chukoh Chemical Industries Ltd.
• Fujitsu Ltd.
• ULVAC, Inc.
• Microtech Ventures, Inc.
• SUSS MicroTec SE
• NTT Advanced Technology Corporation