Package on Package

Package on Package Market Outlook

The global Package on Package (PoP) market is poised for significant growth, projected to reach a market size of approximately USD 5.3 billion by 2035, expanding at a compound annual growth rate (CAGR) of 7.5% during the forecast period from 2025 to 2035. This growth can be attributed to the demand for high-density packaging solutions that optimize space and enhance performance in electronic devices, particularly in consumer electronics and automotive applications. Additionally, the rising adoption of advanced technologies such as 5G and the Internet of Things (IoT) has spurred the development of more compact and efficient packaging solutions. The continuous innovation in semiconductor technologies and the increasing need for miniaturization in electronic products are further fueling the growth of the PoP market. Furthermore, the emphasis on sustainability and environmental concerns is leading manufacturers to invest in eco-friendly packaging solutions, thereby creating new opportunities within the industry.

Growth Factor of the Market

The Package on Package market is experiencing robust growth, driven by a host of interrelated factors. One of the primary factors is the ongoing miniaturization trend in electronic devices, which necessitates more compact packaging solutions to accommodate various components in limited spaces effectively. Additionally, the rapid advancement of mobile technologies and consumer electronics, particularly smartphones and tablets, has led to heightened demand for PoP solutions that enable greater functionality while minimizing surface area. Moreover, the automotive sector is witnessing a paradigm shift toward electric vehicles and advanced driver-assistance systems (ADAS), both of which require sophisticated packaging techniques to integrate numerous electronic components efficiently. Furthermore, the growing demand for high-performance computing and data centers is pushing the envelope for innovative packaging technologies. Lastly, the rise of 5G technology is augmenting the need for high-density packaging to support faster data processing, creating a favorable environment for the PoP market.

Key Highlights of the Market

• The global Package on Package market is projected to grow at a CAGR of 7.5% from 2025 to 2035.
• High demand from the consumer electronics sector is driving significant market expansion.
• Technological advancements in semiconductor manufacturing are enhancing packaging capabilities.
• Automotive applications are increasingly adopting PoP solutions due to the proliferation of electronic systems.
• The Asia Pacific region is expected to dominate the market, driven by major electronics manufacturers.

By Technology

Flip Chip:

Flip Chip technology has emerged as a leading solution in the Package on Package market due to its efficient electrical performance and compact design. In this technique, the chip is flipped upside down and attached to the substrate, allowing for direct contact between the chip's pads and the substrate's conductive areas. This method significantly reduces the interconnection distance, resulting in lower signal loss and improved performance, which is critical in high-frequency applications. Flip Chip packaging is particularly favored in advanced consumer electronics, where space constraint and performance requirements are paramount. Additionally, it supports high-density interconnections, making it suitable for applications that demand high data rates and improved thermal management. As technological advancements continue to evolve, Flip Chip is expected to maintain a strong presence in the PoP market, benefiting from increasing adoption in smartphones and other compact electronic devices.

Through Silicon Via:

Through Silicon Via (TSV) technology represents a cutting-edge approach in the Package on Package market, offering significant benefits in terms of interconnect density and performance. TSV involves creating vertical interconnections through silicon wafers, allowing for three-dimensional stacking of chips. This stacking capability facilitates higher performance, lower power consumption, and reduced form factor, making it particularly appealing for high-performance computing and memory applications. The growing demand for faster data transfer rates and the need to optimize space in electronic devices have propelled the adoption of TSV technology. Moreover, TSV is instrumental in reducing the overall footprint of electronic packages, which is increasingly critical as the industry progresses towards miniaturization. As a result, TSV is expected to play a vital role in the future of the Package on Package market, particularly within sectors that require high-density packaging solutions.

2.5D:

The 2.5D packaging technology is gaining traction in the Package on Package market, especially for applications that require high bandwidth and low latency. This technology enables the integration of multiple chips on a single interposer, creating a space-efficient design that enhances overall performance. The 2.5D architecture allows different technologies to coexist, enabling heterogeneous systems integration and offering flexibility in chip selection. This is particularly beneficial in high-performance computing and networking applications, where speed and efficiency are paramount. Furthermore, the use of an interposer facilitates improved thermal management and signal integrity, making it an attractive option for enterprises looking to maximize performance while minimizing the physical footprint of their devices. As industries continue to push for upgraded processing capabilities, the 2.5D segment is expected to see significant growth within the Package on Package market.

3D:

3D packaging technology is revolutionizing the Package on Package market by offering unparalleled integration capabilities. In this method, multiple dies are stacked vertically, allowing for a compact and efficient use of space, which is crucial in modern electronic applications. The 3D structure supports high interconnect density, enabling faster communication between chips and improved performance, particularly in memory and processing applications. This technology is particularly significant in applications such as high-performance computing, where speed and efficiency are critical. The 3D approach also allows for better thermal management, as heat can be dissipated more effectively with carefully designed layouts. With the surge in demand for high-performance electronic devices, 3D packaging is poised for substantial growth, driving innovation and offering significant advantages to manufacturers and end-users alike.

By Packaging Type

BGA:

Ball Grid Array (BGA) packaging is one of the most prominent types in the Package on Package market, favored for its reliability and performance. BGA employs a grid of solder balls on the package's underside, allowing for efficient heat dissipation and improved electrical performance. This packaging type enables a high density of interconnections while maintaining mechanical strength, making it ideal for various applications, including consumer electronics and telecommunications. The BGA's design reduces the risk of solder joint failure, enhancing the overall reliability of electronic devices. With the increasing complexity of electronic systems and the need for more robust packaging solutions, BGA continues to be a popular choice among manufacturers, driving sustained growth in the PoP market.

QFN:

Quad Flat No-lead (QFN) packaging is another critical segment within the Package on Package market, distinguished by its compact size and low-profile design. QFN packages feature a flat, leadless design that allows for excellent thermal and electrical performance, making them suitable for applications where space constraints are a critical concern. The encapsulation method used in QFN packages minimizes the risk of moisture ingress, ensuring enhanced reliability and performance in challenging environments. Its increasing adoption in consumer electronics, particularly in smartphones and IoT devices, underscores the demand for efficient and space-saving packaging solutions. As the electronics industry moves towards smaller and more efficient devices, QFN packaging is expected to play a significant role in the future of the Package on Package market.

SOP:

Small Outline Package (SOP) is a widely used packaging type in the Package on Package market, known for its versatility and ease of use. SOP packaging is designed to occupy minimal space on printed circuit boards while providing adequate performance for various applications. This packaging type is particularly common in consumer electronics, automotive applications, and telecommunications, where space and cost efficiency are essential. The SOP design allows for easy integration into existing systems, making it a favored choice among manufacturers. Additionally, the compatibility of SOP with automated manufacturing processes enhances its appeal, driving demand and contributing to its significant presence in the PoP market. As technology continues to evolve, SOP is likely to remain a key player in meeting the industry's packaging needs.

CSP:

Chip Scale Package (CSP) is increasingly recognized within the Package on Package market for its compact size and enhanced performance features. CSP packaging provides a high level of integration in a small footprint, making it ideal for applications requiring minimal space. The compact nature of CSP allows for a reduced manufacturing footprint and lower overall assembly costs, which is particularly important in high-volume production environments. CSP is commonly utilized in consumer electronics, automotive, and telecommunications markets, where efficiency and performance are paramount. With the ongoing trend towards miniaturization in electronic devices, the demand for CSP packaging solutions is anticipated to grow, driven by the increasing need for advanced functionality in compact formats.

By Application

Consumer Electronics:

The consumer electronics sector represents a significant portion of the Package on Package market, driven by the relentless demand for innovative and high-performance devices. The proliferation of smartphones, tablets, and wearables has necessitated advanced packaging solutions that optimize space without compromising performance. PoP packaging allows for the integration of multiple functionalities within a compact design, enhancing device capabilities while minimizing size. Furthermore, as the market evolves with the advent of new technologies, such as 5G, manufacturers are increasingly adopting PoP solutions to keep pace with consumer expectations for faster and more efficient devices. This segment is set to experience substantial growth as companies strive to deliver cutting-edge electronics that cater to the evolving needs of consumers.

Automotive:

The automotive sector is rapidly becoming a key application area for the Package on Package market, largely due to the increasing integration of electronic systems in vehicles. Modern automobiles rely heavily on advanced electronic components for safety, navigation, and entertainment systems, creating a demand for efficient packaging solutions. PoP technologies enable the integration of various chip functionalities into a compact package, which is crucial for the limited space available in automotive designs. Additionally, the trend towards electric vehicles and autonomous driving technologies is further fueling demand for high-performance packaging solutions that can manage the growing complexity of electronic systems in vehicles. As automotive technology continues to advance, the PoP market is expected to see significant opportunities for growth within this segment.

Aerospace and Defense:

The aerospace and defense sector is increasingly recognizing the advantages of Package on Package solutions in meeting the stringent requirements of reliability and performance. In this industry, electronic components must withstand extreme environmental conditions while delivering high performance, necessitating advanced packaging technologies. PoP packaging allows for the integration of multiple components in a compact design, reducing weight and enhancing reliability, which are critical factors in aerospace applications. Furthermore, as the demand for sophisticated defense systems and advanced aerospace technologies continues to rise, the need for robust and efficient packaging solutions will only grow. This segment presents lucrative opportunities for PoP manufacturers as they work to meet the specialized needs of aerospace and defense applications.

Healthcare:

The healthcare sector is witnessing a growing implementation of Package on Package technology, primarily driven by the increasing demand for advanced medical devices and diagnostic equipment. PoP solutions offer the compact design and high functionality required in modern healthcare applications, such as wearable health monitors and portable diagnostic devices. As healthcare becomes more reliant on electronic technology for patient care and monitoring, the need for efficient packaging solutions that can integrate multiple functionalities into a small space becomes paramount. Additionally, the shift towards remote patient monitoring and telemedicine is further catalyzing demand for portable medical devices that utilize advanced packaging technologies. Consequently, the healthcare segment is poised for significant growth in the Package on Package market.

Telecommunications:

The telecommunications industry is another major application area for the Package on Package market, driven by the rapid expansion of communication networks and the increasing demand for high-speed data transmission. As telecommunication infrastructure evolves to support 5G and future communication technologies, the need for efficient and high-performance packaging solutions becomes essential. PoP packaging facilitates the integration of multiple components required for advanced communication systems in a compact format, maximizing performance while minimizing space. The shift towards more complex and powerful telecommunication devices is fostering innovation in packaging techniques, further propelling the growth of the PoP market within this sector. As the demand for seamless connectivity continues to rise, the telecommunications segment is expected to drive notable advancements in Package on Package technology.

By User

OEMs:

Original Equipment Manufacturers (OEMs) play a pivotal role in the Package on Package market, constituting a significant user segment. OEMs are responsible for the design and assembly of electronic products, making them crucial stakeholders in the adoption of advanced packaging solutions. As they strive to innovate and improve the performance of their products, OEMs increasingly seek PoP solutions that offer enhanced functionality within limited space. The collaboration between OEMs and packaging technology providers is vital for developing solutions that meet the evolving demands of consumers. Moreover, the growing emphasis on sustainability and cost-effectiveness is prompting OEMs to explore innovative packaging techniques, thereby driving further growth in the PoP market. As the electronics industry progresses, OEMs will continue to be key drivers of demand for packaging solutions that enable advanced product development.

EMS Providers:

Electronics Manufacturing Services (EMS) providers are integral to the Package on Package market, acting as key partners for OEMs in the production and assembly of electronic devices. EMS providers specialize in offering comprehensive manufacturing solutions, including design, prototyping, and assembly, while also ensuring adherence to quality standards. Their expertise in integrating advanced packaging technologies, such as PoP solutions, positions them as essential players in the supply chain. With the increasing complexity of electronic products and the demand for efficient manufacturing processes, EMS providers are continually exploring innovative packaging options to meet the needs of their clients. As the market evolves, the role of EMS providers in driving the adoption of Package on Package technology will become even more pronounced, fostering collaborative relationships between manufacturers and technology providers.

By Region

The regional analysis of the Package on Package market reveals distinct growth trends across various areas. North America is currently a leading region in terms of market share, primarily due to the presence of established technology companies and advanced semiconductor manufacturing capabilities. The region's robust demand for consumer electronics and automotive applications has further solidified its position in the global PoP market. Moreover, the increasing investment in research and development activities and the adoption of innovative packaging solutions are expected to propel market growth in North America. The region is anticipated to maintain a CAGR of around 6.8% during the forecast period, driven by continued technological advancements and strong consumer demand.

In contrast, the Asia Pacific region is expected to witness the highest growth in the Package on Package market, fueled by the rapid expansion of electronics manufacturing and a burgeoning consumer base. Countries such as China, Japan, and South Korea are at the forefront of technological innovation, leading to increased adoption of PoP solutions in various applications, especially consumer electronics and telecommunications. The region's market is projected to grow at a CAGR of approximately 8.7%, driven by the increasing demand for high-performance electronic devices and the ongoing trend of miniaturization. As manufacturers focus on optimizing packaging solutions to meet consumer expectations, Asia Pacific is poised to become a dominant player in the global Package on Package market.

Opportunities

The Package on Package market is ripe with opportunities, particularly as technological advancements continue to reshape the electronics landscape. One of the most significant opportunities lies in the growing demand for high-performance computing solutions. With the increasing reliance on data-intensive applications, there is a pressing need for packaging solutions that can efficiently handle higher processing speeds and greater data volumes. Manufacturers can leverage PoP technology to develop cutting-edge products that cater to this demand, positioning themselves as leaders in the high-performance computing segment. Additionally, the ongoing expansion of 5G technology and the Internet of Things (IoT) is creating a wealth of opportunities for PoP solutions, as these technologies require compact and efficient packaging to support their functionalities. The willingness of consumers to adopt innovative technologies further underscores the potential for growth in this sector.

Another promising area of opportunity in the Package on Package market is the push towards sustainability and environmentally friendly packaging solutions. As consumers become more conscious of the environmental impact of electronic products, manufacturers are increasingly focused on developing eco-friendly packaging that minimizes waste and promotes recycling. This shift presents a compelling opportunity for companies to differentiate themselves in the market by investing in sustainable packaging technologies. By embracing eco-friendly practices and offering innovative solutions, manufacturers can enhance their brand image while attracting environmentally conscious consumers. Furthermore, government regulations and initiatives aimed at reducing electronic waste are likely to drive demand for sustainable packaging solutions, providing a significant growth avenue in the Package on Package market.

Threats

Despite the promising growth prospects, the Package on Package market faces several threats that could hinder its progress. One of the most pressing challenges is the rapid pace of technological change within the electronics industry. As new materials and packaging technologies emerge, manufacturers must continuously adapt to stay competitive. This constant evolution can lead to increased costs for research and development, as companies strive to innovate and meet the expectations of consumers. Additionally, the fast-changing landscape of consumer preferences can make it difficult for manufacturers to anticipate market demands, potentially resulting in overproduction or wastage. Companies that fail to keep up with technological advancements risk losing their competitive edge, making it crucial for them to invest in ongoing innovation and market research to remain relevant.

Another significant threat to the Package on Package market is the fluctuation of raw material prices. The production of packaging technologies relies heavily on various materials, and any volatility in pricing can impact manufacturing costs and profit margins. For instance, semiconductor materials are subject to price fluctuations due to market demand and supply chain disruptions. Such uncertainties can force manufacturers to either increase prices, potentially reducing demand, or to absorb costs and compromise on quality. Additionally, geopolitical factors and trade tensions can impact the availability of critical materials, further complicating the landscape. Therefore, companies operating in the Package on Package market must strategically manage their supply chains and develop contingency plans to navigate these challenges effectively.

Competitor Outlook

• Intel Corporation
• Samsung Electronics
• Taiwan Semiconductor Manufacturing Company (TSMC)
• Amkor Technology
• ASE Group
• STMicroelectronics
• Texas Instruments
• Broadcom Inc.
• NXP Semiconductors
• Microchip Technology Inc.
• ON Semiconductor
• Infineon Technologies
• Qualcomm Incorporated
• MediaTek Inc.
• Siliconware Precision Industries Co., Ltd.

The competitive landscape of the Package on Package market is characterized by a mix of established players and emerging companies striving to capture market share. Major corporations such as Intel Corporation and Samsung Electronics dominate the market, leveraging their extensive research and development capabilities to drive innovation and maintain a competitive edge. These industry giants are continually investing in advanced packaging technologies to enhance their product offerings, ensuring they meet the growing demands of consumers in the electronic sector. Furthermore, partnerships and collaborations among players are increasingly common, as companies seek to combine expertise and resources to develop cutting-edge packaging solutions. The competitive dynamics of the market are expected to intensify as new entrants seek to challenge established players, leading to a vibrant and constantly evolving ecosystem.

In addition to the large corporations, regional players and specialized packaging companies also contribute significantly to the competitive landscape. Companies like Amkor Technology and ASE Group focus on providing tailored packaging solutions, catering to specific customer needs across various applications. Their agility and ability to adapt to market changes enable them to carve out niches within the broader PoP market. Many of these companies are investing in sustainable practices and eco-friendly packaging technologies, aligning with consumer preferences and regulatory demands. As sustainability becomes a focal point for the electronics industry, these companies are well-positioned to capture market opportunities while differentiating themselves from larger competitors.

Key players such as Taiwan Semiconductor Manufacturing Company (TSMC) and Microchip Technology Inc. are also crucial to the competitive outlook of the Package on Package market. TSMC, as a leading semiconductor manufacturer, has been at the forefront of innovations in packaging technology, continuously pushing the boundaries of what is possible in the industry. Their commitment to advanced packaging solutions allows them to serve diverse sectors, from consumer electronics to automotive applications. Meanwhile, Microchip Technology Inc. focuses on delivering high-performance microcontroller and analog semiconductor solutions, emphasizing the importance of integrated packaging technologies. Their ability to adapt to market needs underscores the competitive nature of the Package on Package landscape and highlights the significance of continuous innovation within the sector.

• 1 Appendix

  • 1.1 List of Tables
  • 1.2 List of Figures

• 2 Introduction

  • 2.1 Market Definition
  • 2.2 Scope of the Report
  • 2.3 Study Assumptions
  • 2.4 Base Currency & Forecast Periods

• 3 Market Dynamics

  • 3.1 Market Growth Factors
  • 3.2 Economic & Global Events
  • 3.3 Innovation Trends
  • 3.4 Supply Chain Analysis

• 4 Consumer Behavior

  • 4.1 Market Trends
  • 4.2 Pricing Analysis
  • 4.3 Buyer Insights

• 5 Key Player Profiles

  • 5.1 ASE Group
    • 5.1.1 Business Overview
    • 5.1.2 Products & Services
    • 5.1.3 Financials
    • 5.1.4 Recent Developments
    • 5.1.5 SWOT Analysis
  • 5.2 Broadcom Inc.
    • 5.2.1 Business Overview
    • 5.2.2 Products & Services
    • 5.2.3 Financials
    • 5.2.4 Recent Developments
    • 5.2.5 SWOT Analysis
  • 5.3 MediaTek Inc.
    • 5.3.1 Business Overview
    • 5.3.2 Products & Services
    • 5.3.3 Financials
    • 5.3.4 Recent Developments
    • 5.3.5 SWOT Analysis
  • 5.4 Amkor Technology
    • 5.4.1 Business Overview
    • 5.4.2 Products & Services
    • 5.4.3 Financials
    • 5.4.4 Recent Developments
    • 5.4.5 SWOT Analysis
  • 5.5 ON Semiconductor
    • 5.5.1 Business Overview
    • 5.5.2 Products & Services
    • 5.5.3 Financials
    • 5.5.4 Recent Developments
    • 5.5.5 SWOT Analysis
  • 5.6 Intel Corporation
    • 5.6.1 Business Overview
    • 5.6.2 Products & Services
    • 5.6.3 Financials
    • 5.6.4 Recent Developments
    • 5.6.5 SWOT Analysis
  • 5.7 Texas Instruments
    • 5.7.1 Business Overview
    • 5.7.2 Products & Services
    • 5.7.3 Financials
    • 5.7.4 Recent Developments
    • 5.7.5 SWOT Analysis
  • 5.8 NXP Semiconductors
    • 5.8.1 Business Overview
    • 5.8.2 Products & Services
    • 5.8.3 Financials
    • 5.8.4 Recent Developments
    • 5.8.5 SWOT Analysis
  • 5.9 STMicroelectronics
    • 5.9.1 Business Overview
    • 5.9.2 Products & Services
    • 5.9.3 Financials
    • 5.9.4 Recent Developments
    • 5.9.5 SWOT Analysis
  • 5.10 Samsung Electronics
    • 5.10.1 Business Overview
    • 5.10.2 Products & Services
    • 5.10.3 Financials
    • 5.10.4 Recent Developments
    • 5.10.5 SWOT Analysis
  • 5.11 Infineon Technologies
    • 5.11.1 Business Overview
    • 5.11.2 Products & Services
    • 5.11.3 Financials
    • 5.11.4 Recent Developments
    • 5.11.5 SWOT Analysis
  • 5.12 Qualcomm Incorporated
    • 5.12.1 Business Overview
    • 5.12.2 Products & Services
    • 5.12.3 Financials
    • 5.12.4 Recent Developments
    • 5.12.5 SWOT Analysis
  • 5.13 Microchip Technology Inc.
    • 5.13.1 Business Overview
    • 5.13.2 Products & Services
    • 5.13.3 Financials
    • 5.13.4 Recent Developments
    • 5.13.5 SWOT Analysis
  • 5.14 Siliconware Precision Industries Co., Ltd.
    • 5.14.1 Business Overview
    • 5.14.2 Products & Services
    • 5.14.3 Financials
    • 5.14.4 Recent Developments
    • 5.14.5 SWOT Analysis
  • 5.15 Taiwan Semiconductor Manufacturing Company (TSMC)
    • 5.15.1 Business Overview
    • 5.15.2 Products & Services
    • 5.15.3 Financials
    • 5.15.4 Recent Developments
    • 5.15.5 SWOT Analysis

• 6 Market Segmentation

  • 6.1 Package on Package Market, By Technology
    • 6.1.1 Flip Chip
    • 6.1.2 Through Silicon Via
    • 6.1.3 2.5D
    • 6.1.4 3D
  • 6.2 Package on Package Market, By Application
    • 6.2.1 Consumer Electronics
    • 6.2.2 Automotive
    • 6.2.3 Aerospace and Defense
    • 6.2.4 Healthcare
    • 6.2.5 Telecommunications

• 7 Competitive Analysis

  • 7.1 Key Player Comparison
  • 7.2 Market Share Analysis
  • 7.3 Investment Trends
  • 7.4 SWOT Analysis

• 8 Research Methodology

  • 8.1 Analysis Design
  • 8.2 Research Phases
  • 8.3 Study Timeline

• 9 Future Market Outlook

  • 9.1 Growth Forecast
  • 9.2 Market Evolution

• 10 Geographical Overview

  • 10.1 Europe - Market Analysis
    • 10.1.1 By Country
      • 10.1.1.1 UK
      • 10.1.1.2 France
      • 10.1.1.3 Germany
      • 10.1.1.4 Spain
      • 10.1.1.5 Italy
  • 10.2 Asia Pacific - Market Analysis
    • 10.2.1 By Country
      • 10.2.1.1 India
      • 10.2.1.2 China
      • 10.2.1.3 Japan
      • 10.2.1.4 South Korea
  • 10.3 Latin America - Market Analysis
    • 10.3.1 By Country
      • 10.3.1.1 Brazil
      • 10.3.1.2 Argentina
      • 10.3.1.3 Mexico
  • 10.4 North America - Market Analysis
    • 10.4.1 By Country
      • 10.4.1.1 USA
      • 10.4.1.2 Canada
  • 10.5 Package on Package Market by Region
  • 10.6 Middle East & Africa - Market Analysis
    • 10.6.1 By Country
      • 10.6.1.1 Middle East
      • 10.6.1.2 Africa

• 11 Global Economic Factors

  • 11.1 Inflation Impact
  • 11.2 Trade Policies

• 12 Technology & Innovation

  • 12.1 Emerging Technologies
  • 12.2 AI & Digital Trends
  • 12.3 Patent Research

• 13 Investment & Market Growth

  • 13.1 Funding Trends
  • 13.2 Future Market Projections

• 14 Market Overview & Key Insights

  • 14.1 Executive Summary
  • 14.2 Key Trends
  • 14.3 Market Challenges
  • 14.4 Regulatory Landscape

Segments Analyzed in the Report

The global Package on Package market is categorized based on

By Technology

• Flip Chip
• Through Silicon Via
• 2.5D
• 3D

By Application

• Consumer Electronics
• Automotive
• Aerospace and Defense
• Healthcare
• Telecommunications

By Region

• North America
• Europe
• Asia Pacific
• Latin America
• Middle East & Africa

Key Players

• Intel Corporation
• Samsung Electronics
• Taiwan Semiconductor Manufacturing Company (TSMC)
• Amkor Technology
• ASE Group
• STMicroelectronics
• Texas Instruments
• Broadcom Inc.
• NXP Semiconductors
• Microchip Technology Inc.
• ON Semiconductor
• Infineon Technologies
• Qualcomm Incorporated
• MediaTek Inc.
• Siliconware Precision Industries Co., Ltd.