IC Package Substrates

IC Package Substrates Market Outlook

The global IC package substrates market is projected to reach a valuation of approximately USD 12 billion by 2035, with a compound annual growth rate (CAGR) of around 6% during the forecast period of 2025 to 2035. This growth is primarily driven by the increasing demand for advanced electronic devices, the rising adoption of electric vehicles, and the growing internet of things (IoT) ecosystem. Moreover, the surge in manufacturing capabilities and technological advancements in semiconductor packaging solutions are significantly contributing to market expansion. The integration of miniaturization trends, high-performance computing needs, and the proliferation of consumer electronics are also key factors propelling this market forward.

Growth Factor of the Market

The IC package substrates market is buoyed by several critical growth factors that enhance its dynamics. First, the ongoing shift towards miniaturization and the need for more compact and efficient electronic components are pushing manufacturers to innovate and refine their packaging solutions. Second, the rapid advancements in 5G technology and the related demand for 5G-enabled devices necessitate high-performance IC packages, further stimulating market growth. Additionally, the automotive sector's transition towards electric vehicles (EVs) is significantly increasing the demand for specialized substrates that can support advanced driver-assistance systems (ADAS) and electric powertrain applications. Furthermore, the adoption of automation in industrial applications is driving the demand for reliable and robust packaging solutions that can withstand harsh environments. Lastly, the expansion of the telecommunications sector, particularly in developing regions, is creating new opportunities for IC package substrates, fostering competitive investment and growth in the market.

Key Highlights of the Market

• Projected market size of approximately USD 12 billion by 2035 with a CAGR of 6%.
• Significant growth driven by the adoption of advanced electronic devices and electric vehicles.
• Increasing demand for high-performance IC packages due to the rise of 5G technology.
• Expansion of the telecommunications sector in developing regions creating new opportunities.
• Technological advancements in semiconductor packaging contributing to market dynamics.

By Product Type

Lead Frame:

The lead frame segment represents a traditional yet enduring category within the IC package substrates market. Characterized by its metallic structure, lead frames provide electrical connections for integrated circuits and are commonly used in various applications, including consumer electronics and automotive. The segment benefits from its cost-effectiveness and reliability, especially in mass production settings. With an emphasis on miniaturization, lead frames are evolving to accommodate smaller and more compact packages, thereby enhancing functionality without compromising performance. Manufacturers are increasingly investing in optimized designs to improve thermal management and electrical performance, which bolsters the segment's standing in the competitive landscape.

Organic Substrate:

Organic substrates have emerged as a dominant product type within the IC package substrates market, owing to their excellent electrical properties and lightweight characteristics. These substrates are primarily composed of resin-based materials and are utilized extensively in high-density interconnect (HDI) applications. Their superior performance in terms of thermal conductivity and lower dielectric constant makes them ideal for advanced packaging solutions in consumer electronics and telecom devices. As the demand for high-speed data transmission and miniaturized devices continues to rise, organic substrates are likely to witness sustained growth, driven by innovations that aim to enhance their performance and reliability across various applications.

Ceramic Substrate:

Ceramic substrates are well-regarded for their high thermal stability, excellent dielectric properties, and mechanical strength, making them suitable for demanding applications such as aerospace and defense. The use of ceramic substrates is growing, particularly in high-frequency and high-power electronic devices, where performance is critical. Their ability to withstand extreme temperatures and harsh environments positions them favorably in specialized sectors, including telecommunications and industrial applications. As industries seek out durable and high-performance materials, ceramic substrates are expected to gain traction, driven by advancements in manufacturing processes and a growing understanding of their potential in high-reliability applications.

Laminate Substrate:

Laminate substrates are increasingly popular in the IC package substrates market due to their versatility and affordability. Made primarily from a composite of materials, these substrates can be tailored to meet specific requirements, including different thicknesses, dielectric constants, and thermal performance characteristics. The laminate substrate segment is particularly favored for consumer electronics, as it allows for efficient production processes and customization, catering to the diverse needs of manufacturers. As the electronics industry continues to evolve, laminate substrates are likely to play a crucial role, accommodating the growing demand for efficient and cost-effective packaging solutions for a wide range of devices.

Silicon Substrate:

The silicon substrate segment is witnessing significant advancements due to the unique properties of silicon as a semiconductor material. Known for its electrical performance and compatibility with integrated circuit fabrication processes, silicon substrates are extensively used in high-performance applications, particularly in the telecommunications and automotive sectors. The rising demand for devices that require complex functionalities, such as smartphones and electric vehicles, is driving the growth of silicon substrates. Moreover, ongoing research and development efforts aimed at enhancing silicon substrate performance, such as increasing integration density and reducing manufacturing costs, are expected to bolster this segment's market presence.

By Application

Consumer Electronics:

Consumer electronics represent one of the largest application segments within the IC package substrates market. As the demand for devices such as smartphones, tablets, and wearables continues to rise, the need for reliable and efficient packaging solutions becomes paramount. The segment benefits from rapid technological advancements that drive the development of smaller and more powerful devices, necessitating innovative packaging methods. Furthermore, the increasing integration of advanced features like artificial intelligence (AI) and machine learning (ML) in consumer devices is further amplifying the demand for sophisticated IC packages. Consequently, manufacturers are focusing on developing tailored solutions that cater to the specific needs of this fast-paced market.

Automotive:

The automotive application segment is experiencing robust growth, fueled by the escalating adoption of electric vehicles (EVs) and advanced driver-assistance systems (ADAS). As vehicles become increasingly connected and automated, the demand for high-performance IC package substrates that ensure reliability and durability in automotive environments is paramount. The expansion of EV infrastructure and the integration of smart technologies in vehicles necessitate robust substrate solutions that can withstand extreme conditions while providing optimal performance. Moreover, regulatory pressures for enhanced safety and efficiency in automotive design are driving manufacturers to innovate and invest in state-of-the-art packaging technologies tailored for the automotive sector.

Industrial:

The industrial application segment is gaining traction as industries continue to embrace automation and smart manufacturing technologies. The increased utilization of sensors, robotic systems, and control devices in industrial settings requires reliable IC package substrates that can function effectively in demanding environments. As industries seek greater efficiency and productivity, the need for substrates that can withstand harsh conditions, such as high temperatures and moisture, becomes critical. Furthermore, the growing trend of Industry 4.0 is propelling the demand for sophisticated electronic components, thereby enhancing the relevance of IC package substrates in the industrial sector.

Telecommunications:

The telecommunications sector is another significant application area for IC package substrates, driven by the expansion of communication networks and the rollout of 5G technology. The demand for high-speed data transfer and reliable communication systems is pushing manufacturers to develop advanced substrate solutions that can handle increased data loads while maintaining performance. Additionally, as various sectors, including healthcare, automotive, and entertainment, integrate telecommunications capabilities into their offerings, the need for robust and efficient IC package solutions becomes critical. The ongoing investments in telecommunications infrastructure, particularly in emerging markets, are expected to bolster the demand for IC package substrates in this sector.

Aerospace & Defense:

The aerospace and defense application segment requires specialized IC package substrates that can operate reliably in extreme conditions, including high altitudes and varying temperatures. The stringent requirements for performance, reliability, and safety in this sector necessitate the use of advanced materials and manufacturing processes in substrate design. As governments and companies invest in next-generation aerospace technologies and defense systems, the demand for high-performance IC packages will grow correspondingly. Manufacturers are increasingly focusing on developing lightweight yet durable substrates that can meet the rigorous standards of the aerospace and defense industries, driving innovation and growth within this application segment.

By Distribution Channel

Direct Sales:

The direct sales channel plays a pivotal role in the IC package substrates market, allowing manufacturers to establish direct relationships with their clients and better understand their needs. This approach facilitates customized solutions tailored to specific applications and enhances customer engagement. Direct sales enable manufacturers to provide comprehensive support, including technical consultation and after-sales service, which is crucial in the highly specialized field of IC packaging. This channel also helps in reducing the time to market for new products, as manufacturers can quickly respond to changes in demand and requirements from customers. Overall, the direct sales segment is essential for fostering long-term partnerships and driving innovation in the IC package substrates market.

Distributor:

The distributor channel provides manufacturers with a broader reach to various market segments, enabling them to penetrate new geographic areas and diversify their customer base. Distributors play a crucial role in the supply chain by managing inventory, facilitating logistics, and providing localized support to customers. This channel is particularly advantageous for smaller manufacturers or those new to the market, as it allows them to leverage the established networks and expertise of distributors. Additionally, distributors often provide market insights and customer feedback back to manufacturers, helping inform product development and marketing strategies. As the demand for IC package substrates evolves, the distributor channel will continue to be a vital component in connecting manufacturers with end-users and ensuring market accessibility.

By Material Type

FR-4:

FR-4 is one of the most widely used materials in the production of IC package substrates, known for its excellent electrical insulation properties and mechanical strength. This glass-reinforced epoxy laminate material is highly favored in the consumer electronics sector due to its cost-effectiveness and reliability. FR-4 substrates are particularly noted for their ability to withstand high temperatures and moisture, making them suitable for various applications, including smartphones, tablets, and other electronic devices. As manufacturers continue to push for higher density and performance in their products, the demand for FR-4 materials is expected to remain strong, supported by ongoing innovations in production techniques that enhance their capabilities.

Polyimide:

Polyimide materials are recognized for their exceptional thermal stability and durability, making them ideal for high-performance IC package substrates in automotive and aerospace applications. The unique properties of polyimide allow for efficient heat dissipation, essential in environments where temperature fluctuations are common. As the automotive industry increasingly adopts advanced technologies, including electric and hybrid vehicles, the demand for polyimide substrates is expected to grow significantly. Moreover, the aerospace sector's continuous push for lightweight and robust materials will further enhance the relevance of polyimide in IC package substrate applications, driving research and development efforts in this material category.

PTFE:

Polytetrafluoroethylene (PTFE) substrates are gaining popularity in high-frequency applications due to their excellent electrical properties and low dielectric loss. The unique characteristics of PTFE make it particularly suitable for telecommunications and aerospace applications, where signal integrity and performance are critical. As the demand for high-speed data transmission continues to increase, the role of PTFE substrates in facilitating efficient communication will become increasingly important. Manufacturers are focusing on enhancing PTFE processing techniques to maximize its potential in IC package substrates, driven by the ongoing advancements in wireless communication technologies and the growing need for reliable electrical performance.

Ceramics:

Ceramic materials offer superior mechanical and thermal properties, making them ideal for applications that require high reliability, such as aerospace, automotive, and industrial electronics. The application of ceramics in IC package substrates is particularly advantageous for high-power and high-frequency devices, where their thermal stability and dielectric properties are crucial. As industries seek to improve performance and reliability in their electronic systems, the demand for ceramic substrates is anticipated to rise. Continuous advancements in ceramic processing technologies are also enabling manufacturers to develop more cost-effective solutions, further enhancing their attractiveness in the IC package substrates market.

Silicon:

Silicon substrates have become increasingly important in the IC package substrates market due to their compatibility with semiconductor manufacturing processes and outstanding electrical performance. The demand for silicon substrates is driven primarily by the need for advanced packaging solutions in high-performance electronic devices, including those used in telecommunications and computer applications. As the trend towards miniaturization and increased functionality in devices continues, silicon substrates are expected to play a pivotal role in meeting the requirements for high-speed data processing and efficient power management. Ongoing research in silicon processing and integration technologies will likely yield new opportunities for silicon substrates in the IC package substrates market.

By Region

The Asia Pacific region is anticipated to dominate the IC package substrates market, accounting for approximately 45% of the total market share by 2035. This growth is largely attributed to the presence of major electronics manufacturing hubs in countries like China, Japan, and South Korea, where a substantial demand for consumer electronics drives the need for innovative and efficient packaging solutions. Additionally, the rapid expansion of the automotive and telecommunications sectors in this region is further propelling the demand for high-performance IC package substrates. With a projected CAGR of around 6.5%, the Asia Pacific market is positioned for significant growth, supported by advancements in semiconductor technology and increasing investments in research and development.

North America is also a significant player in the IC package substrates market, contributing approximately 25% to the overall market share. The region's growth is driven by the increasing adoption of advanced technologies, such as 5G and IoT, which require high-performance substrates. The presence of major technology companies and semiconductor manufacturers in the United States further bolsters the market's growth trajectory. Furthermore, the emphasis on safety and innovation in the automotive industry, alongside the expansion of aerospace applications, is expected to sustain the demand for IC package substrates throughout the forecast period. Europe, contributing around 20% to the market, is also experiencing steady growth, primarily due to the demand for high-quality and reliable packaging solutions in automotive, industrial, and telecommunications applications.

Opportunities

The IC package substrates market presents numerous opportunities for growth and innovation, particularly in emerging technologies and applications. One significant opportunity lies in the development of advanced packaging solutions for electric and autonomous vehicles. As the automotive industry undergoes a transformative shift towards electrification and automation, the demand for sophisticated IC package substrates that can support new functionalities and higher performance is expected to surge. This transition requires manufacturers to innovate and adapt their packaging technologies to meet the unique challenges posed by electric powertrains, advanced driver-assistance systems, and connectivity features in modern vehicles. The ongoing research in materials and manufacturing techniques is likely to unlock new possibilities in substrate design, enhancing their performance and reliability in automotive applications.

Another promising opportunity in the IC package substrates market arises from the growth of the IoT ecosystem. As IoT devices proliferate across various sectors, including healthcare, industrial automation, and smart cities, the need for efficient and reliable packaging solutions becomes increasingly critical. Manufacturers have the chance to develop specialized IC package substrates tailored to meet the specific requirements of IoT applications, focusing on miniaturization, energy efficiency, and communication capabilities. The expansion of wireless communication technologies and the increasing demand for real-time data processing capabilities further bolster the prospects for growth in this segment. By leveraging advancements in packaging materials and processes, manufacturers can capitalize on the burgeoning IoT market and position themselves as leaders in providing innovative substrate solutions.

Threats

Despite the numerous opportunities available, the IC package substrates market faces several threats that could impede growth and profitability. One significant threat is the rapid pace of technological advancements in semiconductor packaging and manufacturing processes. As new technologies emerge, existing products may become outdated or less competitive, forcing manufacturers to continually innovate and invest in research and development. This constant need for innovation can strain resources and impact profitability, particularly for smaller players in the market. Furthermore, the increasing globalization of the semiconductor supply chain may exacerbate competition and lead to price pressures, which can negatively affect margins across the industry.

Another challenge facing the IC package substrates market is the potential for supply chain disruptions. Recent global events, such as the COVID-19 pandemic, have highlighted vulnerabilities within supply chains, leading to material shortages and production delays. As the demand for IC package substrates continues to rise, any disruptions in the supply chain—whether due to geopolitical tensions, natural disasters, or logistical challenges—could impact manufacturers' ability to deliver products on time. This situation underscores the importance of developing resilient supply chains and diversifying sourcing strategies to mitigate risks and ensure a steady flow of materials and components in the face of uncertainties.

Competitor Outlook

• Amkor Technology Inc.
• ASE Group
• Jiangsu Changjiang Electronics Technology Co., Ltd.
• Shinko Electric Industries Co., Ltd.
• Unimicro Technologies Inc.
• Kyocera Corporation
• STMicroelectronics N.V.
• Texas Instruments Incorporated
• Infineon Technologies AG
• ON Semiconductor Corporation
• Toshiba Corporation
• Microchip Technology Inc.
• Rohm Semiconductor
• Powertech Technology Inc.
• Nexperia B.V.

The competitive landscape of the IC package substrates market is characterized by the presence of several key players that are continually striving to enhance their product offerings and capture a larger market share. Companies like Amkor Technology and ASE Group are at the forefront of the industry, leveraging their extensive experience and technological expertise to develop advanced packaging solutions that cater to a diverse range of applications. Their commitment to innovation and investment in research and development enable them to stay ahead of market trends, ensuring that they can meet the evolving needs of customers across various sectors. Additionally, these companies focus on establishing strategic partnerships and collaborations to expand their capabilities and enhance their competitive edge in the global market.

Jiangsu Changjiang Electronics Technology Co., Ltd. and Shinko Electric Industries Co., Ltd. are also prominent players in the IC package substrates market, known for their strong manufacturing capabilities and commitment to quality. These companies are investing in cutting-edge technologies to improve production efficiency and product performance, enabling them to cater to the growing demand for high-performance substrates across multiple applications. Furthermore, they are exploring new materials and processes to enhance the thermal and electrical characteristics of their products, thereby addressing the increasing requirements from industries such as automotive, telecommunications, and consumer electronics.

In addition to these established players, newer entrants like Unimicro Technologies and Kyocera Corporation are making significant strides in the market by offering innovative substrate solutions and focusing on customer-centric approaches. These companies are investing in advanced manufacturing technologies and processes to differentiate their offerings and provide value-added solutions to their clients. By embracing sustainability and eco-friendly practices, these players are aligning themselves with market trends that prioritize environmental responsibility, thus appealing to a broader customer base. As the IC package substrates market continues to evolve, the competitive landscape will likely witness increased collaboration and consolidation, as companies seek to leverage synergies and enhance their market positioning.

• 1 Appendix

  • 1.1 List of Tables
  • 1.2 List of Figures

• 2 Introduction

  • 2.1 Market Definition
  • 2.2 Scope of the Report
  • 2.3 Study Assumptions
  • 2.4 Base Currency & Forecast Periods

• 3 Market Dynamics

  • 3.1 Market Growth Factors
  • 3.2 Economic & Global Events
  • 3.3 Innovation Trends
  • 3.4 Supply Chain Analysis

• 4 Consumer Behavior

  • 4.1 Market Trends
  • 4.2 Pricing Analysis
  • 4.3 Buyer Insights

• 5 Key Player Profiles

  • 5.1 ASE Group
    • 5.1.1 Business Overview
    • 5.1.2 Products & Services
    • 5.1.3 Financials
    • 5.1.4 Recent Developments
    • 5.1.5 SWOT Analysis
  • 5.2 Nexperia B.V.
    • 5.2.1 Business Overview
    • 5.2.2 Products & Services
    • 5.2.3 Financials
    • 5.2.4 Recent Developments
    • 5.2.5 SWOT Analysis
  • 5.3 Rohm Semiconductor
    • 5.3.1 Business Overview
    • 5.3.2 Products & Services
    • 5.3.3 Financials
    • 5.3.4 Recent Developments
    • 5.3.5 SWOT Analysis
  • 5.4 Kyocera Corporation
    • 5.4.1 Business Overview
    • 5.4.2 Products & Services
    • 5.4.3 Financials
    • 5.4.4 Recent Developments
    • 5.4.5 SWOT Analysis
  • 5.5 Toshiba Corporation
    • 5.5.1 Business Overview
    • 5.5.2 Products & Services
    • 5.5.3 Financials
    • 5.5.4 Recent Developments
    • 5.5.5 SWOT Analysis
  • 5.6 Amkor Technology Inc.
    • 5.6.1 Business Overview
    • 5.6.2 Products & Services
    • 5.6.3 Financials
    • 5.6.4 Recent Developments
    • 5.6.5 SWOT Analysis
  • 5.7 STMicroelectronics N.V.
    • 5.7.1 Business Overview
    • 5.7.2 Products & Services
    • 5.7.3 Financials
    • 5.7.4 Recent Developments
    • 5.7.5 SWOT Analysis
  • 5.8 Infineon Technologies AG
    • 5.8.1 Business Overview
    • 5.8.2 Products & Services
    • 5.8.3 Financials
    • 5.8.4 Recent Developments
    • 5.8.5 SWOT Analysis
  • 5.9 Microchip Technology Inc.
    • 5.9.1 Business Overview
    • 5.9.2 Products & Services
    • 5.9.3 Financials
    • 5.9.4 Recent Developments
    • 5.9.5 SWOT Analysis
  • 5.10 Powertech Technology Inc.
    • 5.10.1 Business Overview
    • 5.10.2 Products & Services
    • 5.10.3 Financials
    • 5.10.4 Recent Developments
    • 5.10.5 SWOT Analysis
  • 5.11 Unimicro Technologies Inc.
    • 5.11.1 Business Overview
    • 5.11.2 Products & Services
    • 5.11.3 Financials
    • 5.11.4 Recent Developments
    • 5.11.5 SWOT Analysis
  • 5.12 ON Semiconductor Corporation
    • 5.12.1 Business Overview
    • 5.12.2 Products & Services
    • 5.12.3 Financials
    • 5.12.4 Recent Developments
    • 5.12.5 SWOT Analysis
  • 5.13 Texas Instruments Incorporated
    • 5.13.1 Business Overview
    • 5.13.2 Products & Services
    • 5.13.3 Financials
    • 5.13.4 Recent Developments
    • 5.13.5 SWOT Analysis
  • 5.14 Shinko Electric Industries Co., Ltd.
    • 5.14.1 Business Overview
    • 5.14.2 Products & Services
    • 5.14.3 Financials
    • 5.14.4 Recent Developments
    • 5.14.5 SWOT Analysis
  • 5.15 Jiangsu Changjiang Electronics Technology Co., Ltd.
    • 5.15.1 Business Overview
    • 5.15.2 Products & Services
    • 5.15.3 Financials
    • 5.15.4 Recent Developments
    • 5.15.5 SWOT Analysis

• 6 Market Segmentation

  • 6.1 IC Package Substrates Market, By Application
    • 6.1.1 Consumer Electronics
    • 6.1.2 Automotive
    • 6.1.3 Industrial
    • 6.1.4 Telecommunications
    • 6.1.5 Aerospace & Defense
  • 6.2 IC Package Substrates Market, By Product Type
    • 6.2.1 Lead Frame
    • 6.2.2 Organic Substrate
    • 6.2.3 Ceramic Substrate
    • 6.2.4 Laminate Substrate
    • 6.2.5 Silicon Substrate
  • 6.3 IC Package Substrates Market, By Material Type
    • 6.3.1 FR-4
    • 6.3.2 Polyimide
    • 6.3.3 PTFE
    • 6.3.4 Ceramics
    • 6.3.5 Silicon
  • 6.4 IC Package Substrates Market, By Distribution Channel
    • 6.4.1 Direct Sales
    • 6.4.2 Distributor

• 7 Competitive Analysis

  • 7.1 Key Player Comparison
  • 7.2 Market Share Analysis
  • 7.3 Investment Trends
  • 7.4 SWOT Analysis

• 8 Research Methodology

  • 8.1 Analysis Design
  • 8.2 Research Phases
  • 8.3 Study Timeline

• 9 Future Market Outlook

  • 9.1 Growth Forecast
  • 9.2 Market Evolution

• 10 Geographical Overview

  • 10.1 Europe - Market Analysis
    • 10.1.1 By Country
      • 10.1.1.1 UK
      • 10.1.1.2 France
      • 10.1.1.3 Germany
      • 10.1.1.4 Spain
      • 10.1.1.5 Italy
  • 10.2 Asia Pacific - Market Analysis
    • 10.2.1 By Country
      • 10.2.1.1 India
      • 10.2.1.2 China
      • 10.2.1.3 Japan
      • 10.2.1.4 South Korea
  • 10.3 Latin America - Market Analysis
    • 10.3.1 By Country
      • 10.3.1.1 Brazil
      • 10.3.1.2 Argentina
      • 10.3.1.3 Mexico
  • 10.4 North America - Market Analysis
    • 10.4.1 By Country
      • 10.4.1.1 USA
      • 10.4.1.2 Canada
  • 10.5 IC Package Substrates Market by Region
  • 10.6 Middle East & Africa - Market Analysis
    • 10.6.1 By Country
      • 10.6.1.1 Middle East
      • 10.6.1.2 Africa

• 11 Global Economic Factors

  • 11.1 Inflation Impact
  • 11.2 Trade Policies

• 12 Technology & Innovation

  • 12.1 Emerging Technologies
  • 12.2 AI & Digital Trends
  • 12.3 Patent Research

• 13 Investment & Market Growth

  • 13.1 Funding Trends
  • 13.2 Future Market Projections

• 14 Market Overview & Key Insights

  • 14.1 Executive Summary
  • 14.2 Key Trends
  • 14.3 Market Challenges
  • 14.4 Regulatory Landscape

Segments Analyzed in the Report

The global IC Package Substrates market is categorized based on

By Product Type

• Lead Frame
• Organic Substrate
• Ceramic Substrate
• Laminate Substrate
• Silicon Substrate

By Application

• Consumer Electronics
• Automotive
• Industrial
• Telecommunications
• Aerospace & Defense

By Distribution Channel

• Direct Sales
• Distributor

By Material Type

• FR-4
• Polyimide
• PTFE
• Ceramics
• Silicon

By Region

• Asia Pacific
• North America
• Europe
• Latin America
• Middle East & Africa

Key Players

• Amkor Technology Inc.
• ASE Group
• Jiangsu Changjiang Electronics Technology Co., Ltd.
• Shinko Electric Industries Co., Ltd.
• Unimicro Technologies Inc.
• Kyocera Corporation
• STMicroelectronics N.V.
• Texas Instruments Incorporated
• Infineon Technologies AG
• ON Semiconductor Corporation
• Toshiba Corporation
• Microchip Technology Inc.
• Rohm Semiconductor
• Powertech Technology Inc.
• Nexperia B.V.